{"id":6538,"date":"2019-06-20T05:01:03","date_gmt":"2019-06-20T05:01:03","guid":{"rendered":"https:\/\/www.findadistributor.com\/news\/?p=6538"},"modified":"2019-06-17T16:05:46","modified_gmt":"2019-06-17T16:05:46","slug":"jacob-gaspari-receives-packaging-scholarship","status":"publish","type":"post","link":"https:\/\/www.findadistributor.com\/news\/jacob-gaspari-receives-packaging-scholarship\/","title":{"rendered":"Jacob Gaspari Receives Packaging Scholarship"},"content":{"rendered":"

Jacob Gaspari, a student at Columbus Central Community College (Nebraska), has been named recipient of the 2019 Richard C. Ryan Packaging Education Scholarship, funded by Dorner<\/a>.<\/p>\n

This $2,000 scholarship is awarded to a student enrolled in a two- or four-year program at any of PMMI\u2019s partner schools. The scholarship was established in honor of Richard Ryan, the former president and CEO of Dorner<\/a>, who passed away suddenly in September 2012.\u00a0Ryan was a member of the PMMI Board of Directors and encouraged lifelong learning. His commitment to education inspired the creation of this memorial scholarship.<\/p>\n

Jacob is pursuing a mechatronics degree at Columbus Central Community College. He\u2019s been employed as an electromechanical technician for the past four years at Becton, Dickinson and Company, a healthcare safety and technologies company in Columbus, Nebraska, and also served as a wheeled vehicle technician in the Nebraska Army National Guard.<\/p>\n

\u201cAs an electromechanical technician, it is imperative to have the knowledge and skill set that the mechatronics program will provide,\u201d Gaspari wrote in his scholarship\u2019s essay. \u201cI love this line of work. I can see many pathways that this type of career can take me and they are all exciting and intriguing.\u201d<\/p>\n

The field of candidates for this year\u2019s Ryan Packaging Education Scholarship was extremely deep, but it was Gaspari\u2019s diverse background and experience that helped distinguish him from others.<\/p>\n

\u201cJacob is a veteran and is already working for a leading manufacturer of packaged consumer goods.\u00a0Jacob, along with many of the candidates, referenced an interest and a real passion for working with their hands, tinkering with machines and coming up with creative ways to solve mechanical problems,\u201d said Matt Jones, Vice President of Sales and Marketing, Dorner<\/a>. \u201cRich liked to do the same, whether he was working on his motorcycles or working on complex strategic decisions.\u00a0We are very happy to award Jacob with this scholarship as a fitting way to honor a past President and CEO of our business.\u201d<\/p>\n

Now in its sixth year, the Richard C. Ryan Packaging Education Scholarship is awarded to a student who presents merit in GPA, faculty recommendation and commitment to excellence within the packaging industry.<\/p>\n

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Jacob Gaspari, a student at Columbus Central Community College (Nebraska), has been named recipient of the 2019 Richard C. Ryan Packaging Education Scholarship, funded by Dorner.<\/p><\/div>\n

Students applying for the scholarship must meet the following criteria:<\/strong><\/p>\n